TR7600 INLINE
TR7600 INLINE
• The ideal solution for testing BGA components and non-zones accessible per others test technologies.
INTRODUCTION
The TR7600 In-line Automated X-Ray Inspection System uses X-Ray technology to penetrate PCBs and components to capture test images. TRI technology owner image evaluation uses captured images with nine different angles. It examines the dark and light areas, separates the different image slices, and calculates the slice height difference during manufacturing defect inspection. Data is sent to the Repair Station TR7600 to analyze and trigger personal fabrication.
Características
• In-line, alta velocidade de imagem dinâmica do sistema inspeção AXI pre/post reflow PCBA;
• Excelente tecnologia de inspecção utilizada proporcio altas taxas de detecção e cobertura de defeito;
• Pode detectar BGA opens e shorts, assim como as missing, billboard, tombstone, skew, IC lead up, DIP sodering defects para componentes fine-pitch; fluxo ATPG orienta os usuários a criar o programa de inspeção rápida e facilmente;
• O sistema da Estação de Reparo ajuda o usuário a confirmar o defeito facilmente com interface gráfica amigável e oferece álculo e relatórios CPE;
• Melhor preço/ desempenho de todos sistemas na linha AXI;
• Disponvel para ligação com YMS para integrar e analisar os dados de todas as linhas de produção.
Especificações
CameraHigh-performance, ultra-sensitive line-scan cameras
X-ray SourceMicrofocus tube 130 kV max (user adjustable)
Imaging Resolution10 μm, 15 μm, 20 μm (factory setting)
Inspection Method2.5D, 3D Slicing, Planar CT (optional)
Motion Table & Control
X-Axis ControlHigh-precision ballscrew + AC-servo controller
Y-Axis ControlHigh-precision ballscrew + AC-servo controller
Z-Axis ControlHigh-precision ballscrew + AC-servo controller
X-Y Axis Resolution1 µm
Board Handling
Max PCB Size900 x 460 mm
PCB Thickness0.6-5 mm
Max PCB Weight3 kg [8 kg optional]
Top Clearance@ 20 μm: 50 mm
@ 15 μm: 30 mm
@ 10 μm: 15 mm
Bottom Clearance40 mm
Edge Clearance3 mm
Conveyor Height880 - 920 mm
* SMEMA Compatible
Inspection Functions
ComponentMissing
Misalignment
Tombstone
Billboard
Tantalum Polarity
Rotation
Floating
SolderInsufficient/Excess Solder
Bridging
Open
Solder Ball
Non-wetting
Void
Lifted Lead
Dimensions
WxDxH1495 x 2080 x 1650 mm
Note: not including signal tower, height: 515 mm
Weight3250 kg
Power Requirement200 – 240 VAC single phase, 50/60 Hz, 4 kVA
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