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Did you know that finding a defect at the beginning of the assembly of the boards, with inspection techniques can be hundreds of times cheaper than after the assembly of the same ones?

At each stage of the plate assembly process, if automatic inspection is performed, it is possible to identify possible failures, such as after applying the solder paste through a PRINTER, or after inserting components, so that they are in accordance with the their correct position on the board, or even after, allowing the components to be soldered properly and without overexposure.

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If the problem is discovered early in the process, it is only possible to clean the plate and prevent them from being replicated for a large number of parts, so it is easy to correct errors punctually instead of having to disassemble several parts of the product or even discard the ask.

Properly managing defects in electronic boards has become easier through inspection equipment such as SPI (Solder Past Inspection) and AOI (Automated Optical Inspection), which performs the inspection of the paste and components, capturing images of the board and components , therefore, the AOI is the final proof that everything went as expected and the equipment will not present defects in relation to positioning when it reaches the end customer.


The inspection takes place through a program developed with validated libraries of model plates that performs the comparison with the material produced, that is, the plate produced must be exactly the same as the one that was used as a model.


If there are differences, the operator will receive a notice to correct the problem. Among the errors detected in this step are: replaced components (due to the difference in screen printing), inverted assembled components, lack of components, possible short circuits in the weld, excess welding and lack of welding, among others.

To learn more about SPI and AOI, click on the button below:

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