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ENCONTRE-NOS

Av. Alípio Octaviano de Souza Paraíso, 330 Sala 01  | Parque Residencial Paraíso
Itupeva/SP  CEP: 13.295-000

 

© 2018 Tekno-Sip | All rights reserved

Features

 • High precision desktop AOI solution for pre/post-reflow inspection
 • Quick & Easy programming with IPC standard compliance
 • Advanced algorithms and multi-phase lighting for minimum false calls

Specifications

Optical System

Imaging MethodDynamic Imaging

Top Camera4 Mpix

Angle CameraN/A

Imaging Resolution10 µm, 15 µm (factory setting)

LightingMulti-phase RGB+W LED

3D TechnologyN/A

Max. 3D RangeN/A

Inspection Performance

Imaging Speed4 Mpix@ 10 µm: 60 cm²/sec
4 Mpix@ 12.5 µm: 120 cm²/sec

Motion Table & Control

X-Axis ControlBallscrew + AC-servo controller

Y-Axis ControlBallscrew + AC-servo controller

Z-Axis ControlN/A

X-Y Axis Resolution1 µm

Board Handling

Max PCB SizeTR7700 SIII DT: 330 x 250 mm
TR7700L SIII DT: 510 x 460 mm

PCB Thickness3 mm

Max PCB Weight3 kg

Top Clearance25 mm [48 mm optional]

Bottom ClearanceTR7700 SIII DT: 100 mm
TR7700L SIII DT: 50 mm

Edge Clearance3 mm

ConveyorManual

Inspection Functions

ComponentMissing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material

SolderExcess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination

Dimensions

WxDxHTR7700 SIII DT: 800 x 1100 x 1350 mm
TR7700L SIII DT: 980 x 1290 x 1400 mm

WeightTR7700 SIII DT: 340 kg
TR7700L SIII DT: 385 kg

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