he World's First Hybrid AOI: TR7700 SII Plus 
Utilizing a new hybrid inspection design, the TR7700 SII Plus can leverage both stop-and-go strategy and dynamic imaging to achieve optimal inspection performance on all types of PCBAs, e.g.: Inspection Cycle Time Reduction. Simply switch the inspection mode to determine the best approach for your product.


• Flexible Stop-and-Go or Dynamic Imaging AOI

• Intelligent Easy Programming Interface

• Rapid Changeover with Intelligent Auto Conveyor

• Foreign Material and Extra Component Inspection

• 10 μm or 15 μm resolution


Optical System

Imaging MethodDynamic Imaging or Stop-and-Go on select configurations

Top Camera4 or 9 or 12 Mpix high speed color camera (factory setting)

Angle CameraN/A

Imaging Resolution6 µm, 10 µm, 15 µm (factory setting)

LightingMulti-phase RGB+W LED

3D TechnologyN/A

Max. 3D RangeN/A

Inspection Performance

Imaging Speed4 Mpix@ 10 µm Dynamic Imaging: 60 cm²/sec 
4 Mpix@ 15 µm Dynamic Imaging: 120 cm²/sec
9 Mpix@ 10 µm Dynamic Imaging: 72 cm²/sec
12 Mpix@ 6 µm Dynamic Imaging: 120 cm²/sec
4 Mpix@ 10 µm Stop-and-Go: 4.5 FOV/sec
4 Mpix@ 15 µm Stop-and-Go: 4.5 FOV/sec

Motion Table & Control

X-Axis ControlBallscrew + AC-servo controller

Y-Axis ControlBallscrew + AC-servo controller

Z-Axis ControlN/A

X-Y Axis Resolution1 µm

Board Handling

Max PCB SizeTR7700 SII Plus@ 10 µm, 15 µm: 510 x 460 mm
TR7700 SII Plus@ 6 µm: 400 x 400 mm
TR7700 SII Plus DL@ 10 µm, 15 µm: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
TR7700 SII Plus DL@ 6 µm: 400 x 310 mm x 2 lanes, 400 x 400 mm x 1 lane

PCB Thickness0.6-5 mm

Max PCB Weight3 kg

Top Clearance10 µm, 15 µm: 25 mm [48 mm optional◎※]
6 µm: 25 mm

◎The air blow module does not apply to this option
※This option is only available for 4 Mpix camera. 

Bottom Clearance10 µm, 15 µm: 40 mm [100 mm optional]
6 µm: 40 mm

Edge Clearance3 mm [5 mm optional]

Height: 880 – 920 mm
* SMEMA Compatible

Inspection Functions

Wrong Marking (OCV)
Upside Down
Extra Component
Foreign Material

SolderExcess Solder
Insufficient Solder
Through-hole Pins
Lifted Lead
Golden Finger



WxDxHTR7700 SII Plus: 1000 x 1400 x 1650 mm
TR7700 SII Plus DL: 1000 x 1500 x 1650 mm

Note: not including signal tower, signal tower height 520 mm

WeightTR7700 SII Plus: 600 kg
TR7700 SII Plus DL: 650 kg


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