TR7007/ TR7007 SII

• TR7007 offers 3D Solder Paste Inspection adopting Fringe Pattern technology and dual light source, thus solving shadow and reflection issues simultaneously. It is equipped with linear motor and scale that offer greater precision in the XY table system

INTRODUCTION

The quality of the start of the SMT process comes from improving the solder paste print quality. TRI Three-dimensional solder paste inspection system, can quickly measure the area, volume, and thickness of each solder joint and can detect short circuits. It is ideal for small, high-density products, avoiding bad connections as a result of small solder joints and lack of soldering, component vibration and heat expansion, improving product quality.

TR7007

TR7007 offers 3D Solder Paste Inspection by adopting Fringe Pattern technology and dual light source, thus solving shadow and reflection issues simultaneously. It is equipped with linear motor and scale that offer greater precision in the XY table system

TR7007 SII

Capable of inspecting at speeds up to 200 cm²/sec, the TR7007 SII is the fastest 3D Solder Paste Inspection System in the industry. This high-speed, high-precision in-line shadow-free solder inspection system offers 3D inspection at a resolution of 15 mm or 10 µm. In addition, powerful new features include a closed loop function, 2D image enhancement, auto-warp compensation and Moiré technology phase scanning. Increase capacity without sacrificing additional space with a dual lane configuration.

Características

• Tecnologia padrão Fringe
• Inspeção acelera a 200cm 2 / s @ 15um, 90cm 2 / s @ 10um
• Shadow Free aprimora imagem 2D
• Motor e escala linear criam um sistema de movimento tabela de XY ainda mais preciso e estável
• Inspeção 3D Excelente e tecnologia de operação com sistema de wrap auto-tracking, fornece capacidade de detecção de defeito excelente
• Grande capacidade de inspeção do processo de fabricação do lead-free e componentes fine-pitch/ 01005
• Gerador de programa de teste de fluxo automático suave(ATPG) permite aos usuários criar programas de inspeção rápida e facilmente
• SPC sistema de cálculo dos dados estatísticos e fornece relatórios estatísticos
• Disponível para vincular com YMS para integrar e analisar os dados dos sistemas de TRI em todas as linhas de produção

Especificações

• Camera type 4 MP camera

• Optical resolution 10 µm or 15 µm (factory setting)

• Lighting LED lit fringe pattern

• Inspection speed Up to 90 cm2/sec @ 10 µm

Up to 200 cm2/sec @ 15 µm

• Inspection performance

• Height resolution 0.4 µm

• Min solder paste pitch 100 µm

• Board size

。TR7007M SII 50 x 50 – 350 x 350 mm

。TR7007 (LL) SII 50 x 50 – 510 x 460 mm (850 x 610 mm)

。TR7007 SII DUALLANE 50 x 50 – 510 x 310 mm

Downloads

Please reload