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TR7700QI

 

The TR7700QI 3D AOI combines the latest of 2D and 3D technologies based on digital quad fringe pattern projection to revolutionize PCB assembly inspection. The versatile programmable 3D digital fringe pattern technology covers a huge inspection range with great accuracy, revealing even the smallest coplanarity defects and solder joint issues.Ensure the quality of solder joints using IPC-compliant 3D solder filet inspection. By checking the filet shape, the TR7700QI 3D AOI can detect insufficient solder volume, non-wetting and dry pads.

TR7700QI.jpg

Features

• Ultra-high Precision 2D+3D Stop-and-Go AOI
• Solder Height and Volume Inspection
• Accurate Quad 3D Digital Fringe Projection
• Adaptive 3D height Range up to 30 mm
• Air-free Intelligent Conveyor System (IACS)

Specifications

Optical System

Imaging MethodStop-and-Go Imaging

Top Camera4 Mpix or 12 Mpix (factory setting)

Angle CameraN/A

Imaging Resolution10 µm, 15 µm (factory setting)

LightingMulti-phase True Color LED

3D TechnologyQuad Digital Fringe Projectors

Max. 3D Range0-20 mm

Inspection Performance

Imaging Speed4 Mpix@ 15 µm: 21 cm²/sec
12 Mpix@ 10 µm: 14.5 cm²/sec
12 Mpix@ 10 µm: 23 cm²/sec with optional CoaXPress

Note: Depending on component distribution

Motion Table & Control

X-Axis ControlBallscrew + AC-servo controller

Y-Axis ControlBallscrew + AC-servo controller

Z-Axis ControlBallscrew + AC-servo controller

X-Y Axis Resolution1 μm with linear encoder

Board Handling

Max PCB SizeTR7700QI: 510 x 460 mm
TR7700QI DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane

PCB Thickness0.6-5 mm

Max PCB Weight3 kg

Top Clearance15 µm: 40 mm
10 µm: 50 mm

Bottom Clearance40 mm [100 mm optional]

Edge Clearance3 mm [5 mm optional]

ConveyorInline
Height: 880 – 920 mm
* SMEMA Compatible

Inspection Functions

ComponentMissing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material
Lifted Component

SolderSolder Fillet Height
Solder Volume %
Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination

Dimensions

WxDxHTR7700QI: 1000 x 1500 x 1650 mm
TR7700QI DL: 1000 x 17000 x 1650 mm

Note: not including signal tower, signal tower height 520 mm

WeightTR7700QI: 650 kg
TR7700QI DL: 685 kg

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