TR7600F3D
The TR7600F3D presents a next generation inspection platform for the most demanding PCB design. The inline CT AXI solution combines ultra-high resolution imaging with high definition planar CT inspection, a new robust hardware platform and a redesigned intuitive software to achieve exceptional image quality and reliable inspection results.
Features
• High Resolution 3D CT X-Ray Inspection
• True 3D Solder Joint Viewer
• Ultra High Resolution for 03015mm Chips
Specifications
Imaging System
Camera7M flat panel detector
X-ray SourceMicrofocus tube 130 kV max (user adjustable)
Imaging Resolution5 μm ,10 μm, 15 μm, 20 μm, 25 μm, 30 μm (3 settings factory configured)
Inspection Method2D, 2.5D, 3D Slicing, Planar CT
Motion Table & Control
X-Axis ControlHigh-precision ballscrew + AC-servo controller
Y-Axis ControlHigh-precision ballscrew + AC-servo controller
Z-Axis ControlHigh-precision ballscrew + AC-servo controller
X-Y Axis Resolution1 µm
Board Handling
Max PCB Size900x460 mm
PCB ThicknessMax. 7 mm
Max PCB Weight12 kg
Top Clearance@ 20/25/30 μm: 50 mm
@ 15 μm: 45 mm
@ 10 μm: 25 mm
@ 5 μm: 5 mm
Bottom Clearance@ 30 μm: 65 mm
@ 5/10/15/20/25 μm: 70 mm
Edge Clearance3 mm [5 mm optional]
Conveyor Height880 - 920 mm
* SMEMA Compatible
Inspection Functions
ComponentMissing
Misalignment
Tombstone
Billboard
Tantalum Polarity
Rotation
Floating
SolderInsufficient/Excess Solder
Bridging
Open
Solder Ball
Non-wetting
Void
Lifted Lead
Dimensions
WxDxH1470 x 2110 x 1975 mm
Note: not including signal tower, height: 510 mm
Weight3850 kg
Power Requirement200 - 240 VAC single phase, 50/60 Hz, 4 kVA
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