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ENCONTRE-NOS

Av. Alípio Octaviano de Souza Paraíso, 330 Sala 01  | Parque Residencial Paraíso
Itupeva/SP  CEP: 13.295-000

 

© 2018 Tekno-Sip | All rights reserved

Features

• High Resolution 3D CT X-Ray Inspection
• True 3D Solder Joint Viewer
• Ultra High Resolution for 03015mm Chips

Specifications

Imaging System

Camera7M flat panel detector

X-ray SourceMicrofocus tube 130 kV max (user adjustable)

Imaging Resolution5 μm ,10 μm, 15 μm, 20 μm, 25 μm, 30 μm (3 settings factory configured)

Inspection Method2D, 2.5D, 3D Slicing, Planar CT

Motion Table & Control

X-Axis ControlHigh-precision ballscrew + AC-servo controller

Y-Axis ControlHigh-precision ballscrew + AC-servo controller

Z-Axis ControlHigh-precision ballscrew + AC-servo controller

X-Y Axis Resolution1 µm

Board Handling

Max PCB Size900x460 mm

PCB ThicknessMax. 7 mm

Max PCB Weight12 kg

Top Clearance@ 20/25/30 μm: 50 mm
@ 15 μm: 45 mm
@ 10 μm: 25 mm
@ 5 μm: 5 mm

Bottom Clearance@ 30 μm: 65 mm
@ 5/10/15/20/25 μm: 70 mm

Edge Clearance3 mm [5 mm optional]

Conveyor Height880 - 920 mm

* SMEMA Compatible
 

Inspection Functions

ComponentMissing
Misalignment
Tombstone
Billboard
Tantalum Polarity
Rotation
Floating

SolderInsufficient/Excess Solder
Bridging
Open
Solder Ball
Non-wetting
Void
Lifted Lead

Dimensions

WxDxH1470 x 2110 x 1975 mm

Note: not including signal tower, height: 510 mm

Weight3850 kg

Power Requirement200 - 240 VAC single phase, 50/60 Hz, 4 kVA

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