Built upon latest 3D projection technology, the TR7007DI SPI offers industry leading inspection accuracy for the most demanding applications. The inline inspection system automatically optimizes the inspection route for best performance, and TRI's innovative SmartWarp system compensates for any board warpage during inspection. The TR7007DI is a versatile SPI solution bringing accuracy and speed to your fingertips.


• 100% Shadow-free Dual Digital Fringe projectors
• Optimized Stop-and-Go Design for Maximum Accuracy
• SmartWarp Compensation Eliminates Local PCB Deformation
• 100% Solder Paste Defect Coverage including Low Bridges


Optical System

Imaging MethodStop-and-Go Imaging

Top Camera4 Mpix or 12 Mpix (factory setting)

Angle CameraN/A

Imaging Resolution10 µm, 15 µm (factory setting)

LightingMulti-phase True Color LED

3D TechnologyQuad Digital Fringe Projectors

Max. 3D Range0-20 mm

Inspection Performance

Imaging Speed4 Mpix@ 15 µm: 21 cm²/sec
12 Mpix@ 10 µm: 14.5 cm²/sec
12 Mpix@ 10 µm: 23 cm²/sec with optional CoaXPress

Note: Depending on component distribution

Motion Table & Control

X-Axis ControlBallscrew + AC-servo controller

Y-Axis ControlBallscrew + AC-servo controller

Z-Axis ControlBallscrew + AC-servo controller

X-Y Axis Resolution1 μm with linear encoder

Board Handling

Max PCB SizeTR7700QI: 510 x 460 mm
TR7700QI DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane

PCB Thickness0.6-5 mm

Max PCB Weight3 kg

Top Clearance15 µm: 40 mm
10 µm: 50 mm

Bottom Clearance40 mm [100 mm optional]

Edge Clearance3 mm [5 mm optional]

Height: 880 – 920 mm

* SMEMA Compatible

Inspection Functions

Wrong Marking (OCV)
Upside Down
Extra Component
Foreign Material
Lifted Component

SolderSolder Fillet Height
Solder Volume %
Excess Solder
Insufficient Solder
Through-hole Pins
Lifted Lead
Golden Finger


WxDxHTR7700QI: 1000 x 1500 x 1650 mm
TR7700QI DL: 1000 x 17000 x 1650 mm

Note: not including signal tower, signal tower height 520 mm

WeightTR7700QI: 650 kg
TR7700QI DL: 685 kg


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