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The TR7700QE AOI offers high performance 3D solder and assembly inspection by combining the next generation 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection. Latest inspection software ensures quick CAD-based programming and features fully customizable templates for zero escapes on any PCBAs.


• Advanced 2D + 3D Coverage
• 4-way Digital Fringe Projectors
• Up to 20 mm 3D Height Range
• High Speed CoaXPress Imaging
• Optional 3D Laser Module


Optical System

Imaging MethodStop-and-Go Imaging

Top Camera12 Mpix

Angle Camera6.5 Mpix

Imaging Resolution10 µm, 15 µm (factory setting)

LightingMulti-phase true color LED, Coaxial lighting

3D TechnologyQuad Digital Fringe Projectors

Max. 3D Range12 Mpix@ 10 µm: 0-10 mm
12 Mpix@ 15 µm: 0-40 mm*

* Need GPU card upgrade

Inspection Performance

Imaging Speed12 Mpix@ 10 µm: 13.5 cm²/sec
12 Mpix@ 10 µm: 23 cm²/sec with optional CoaXPress
12 Mpix@ 15 µm: 30 cm²/sec
12 Mpix@ 15 µm: 50 cm²/sec with optional CoaXPress

Note: Depending on component distribution 

Motion Table & Control

X-Axis ControlBallscrew + AC-servo controller (Linear motor optional)

Y-Axis ControlDual driven ballscrew + AC-servo controller

Z-Axis ControlBallscrew + AC-servo controller

X-Y Axis Resolution1 µm

Board Handling

Max PCB SizeTR7500QE: 510 x 460 mm
TR7500L QE: 660 x 610 mm
TR7500QE DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane

PCB Thickness0.6-5 mm

Max PCB Weight3 kg

Top Clearance50 mm

Bottom Clearance40 mm

Edge Clearance3 mm [5 mm optional]

Height: 880 – 920 mm

* SMEMA Compatible

Inspection Functions

Wrong Marking (OCV)
Upside Down
Extra Component
Foreign Material
Lifted Component

SolderSolder Fillet Height
Solder Volume %
Excess Solder
Insufficient Solder
Through-hole Pins
Lifted Lead
Golden Finger


WxDxHTR7500QE: 1100 x 1730 x 1750 mm
TR7500L QE: 1250 x 1880 x 1750 mm
TR7500QE DL: 1100 x 1830 x 1750 mm

Note: not including signal tower, signal tower height 520 mm

WeightTR7500QE: 920 kg
TR7500L QE: 1170 kg
TR7500QE DL: 950 kg


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