Did you know that finding a defect at the beginning of mounting boards with inspection techniques can be hundreds of times cheaper than after mounting them?

In each step of the plate assembly process, if automatic inspection is performed, it is possible to identify possible failures, such as after the application of the solder paste through a PRINTER, or after the insertion of components, so that they are in accordance with the correct position on or even after the plate, allowing components to be soldered properly and without overexposure.

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If the problem is discovered early in the process, it is only possible to clean the plate and prevent it from being replicated to a large number of parts, so it is easy to correct errors punctually rather than having to disassemble various parts of the product or even discard the product. piece.

Good defect management on electronic boards is made easier by inspection equipment such as SPI (Solder Past Inspection) and AOI (Automated Optical Inspection), which conducts paste and component inspection by capturing images of the board and components. Therefore, AOI is the final proof that everything went as expected and the equipment will not be defective in positioning when it reaches the end customer.

The inspection takes place through a program developed with validated model plate libraries that compares it with the material produced, ie the plate produced must be exactly the same as the one placed as a model. 

If there are differences, the operator will be prompted to correct the problem. Errors detected in this step include: exchanged components (due to difference in screen printing), inverted assembled components, missing components, possible soldering short circuits, over soldering and missing soldering, among others.

To learn more about SPI and AOI visit the button below:

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